Memory chip
Nomor Bagian
CYPRESS (Cypress)
Pabrikan
3.3V 8Gbit
Keterangan
77059 PCS
Persediaan
Nomor Bagian
GigaDevice (GigaDevice Innovation)
Pabrikan
The E version uses a 12-inch wafer and a 55-nanometer process
Keterangan
96166 PCS
Persediaan
Nomor Bagian
ISSI (American core into)
Pabrikan
Keterangan
77200 PCS
Persediaan
Nomor Bagian
HGC (Shenzhen Hanxin)
Pabrikan
1.7-5.5V wide working voltage
Keterangan
72690 PCS
Persediaan
Nomor Bagian
GigaDevice (GigaDevice Innovation)
Pabrikan
Keterangan
81756 PCS
Persediaan
Nomor Bagian
MK (Mike Foundry)
Pabrikan
128Gbit industrial wide temperature grade eMMC 5.0 , MLC, 11.5x13mm
Keterangan
76034 PCS
Persediaan
Nomor Bagian
HGC (Shenzhen Hanxin)
Pabrikan
1.7-5.5V wide working voltage
Keterangan
87155 PCS
Persediaan